UpLink

Andrew mail

OSHWA UID

US002826 Project Website

Certification Date

May 01, 2026

Country

United States of America

UpLink is a high altitude balloon payload testing the insulation properties of certain plastics and the ability to successfully broadcast images over the LoRa protocol.

Version

1.0

Licenses
Hardware
CERN-OHL-S-2.0
Software
MIT
Documentation
MIT
View Documentation

Certification mark

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Project Type
Space
3D Printing
Electronics
Enclosure
Keywords
high altitude balloon, stratosphere, HAB

Citations