Silicon wafer precision scribing system
Remi Rafael mail
This design is a precision scribing system for silicon wafer. In microelectronic, multiple devices are made on silicon wafers by photolithography before the wafer is cut to separate each device. Dicing is generally done with special saws but it is also possible (and more economical) to use a diamond tip to scratch (scribe) the wafer and break (cleave) it over its crystalline directions. This device is designed to make the scribing more precise at a low cost. It can also be used for glass.
Version
1.0Licenses
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Project Type
Science
3D Printing
Electronics
Tool
